On April 20, 1989, Universen
Hitec Ltd. was founded by Mr. William Yeh, an formal engineer of
TI Taiwan and several other semiconductor companies. To begin with two sets of
Disco DAD 2H/6 dicing saws and eight employees, Universen Hitec has been
always dedicating itself to the field of wafer dicing. To
achieve that purpose, Universen DO NOT and WILL NOT SELL ANY
Semiconductor chip / dice that our customers are dealing with! Due
to our excellent and experienced engineers and operators, Universen has
been growing ever since established. In addition to Hsintien
plant, Universen also co-operate with "United Silicon Electronics Co.,
Ltd", located in ShenZhen, China.
Hsintien plant was moved to Lungtan in April 2001. At the end of
2006, Univesen owned around 30 sets of various Wafer-Probers, Back
Grinder, Dicing Saws, and so on, with total 100 employees. We are
capable of handling silicon wafers up to 8-inch.
the ESD issue during dicing process, Universen also sell Anti-Static
System for Ultra Pure Wafer.
from 2001, Universen also buy & sell related equipments and tools.
Lungtan Plant Disco DAD321
TSK A-WD-10A / Disco DCS141
In 2001, Universen began to provide Si
wafer Back grinding service. The thinnest wafer Universen can
handle is down to
6mil(6" wafer) & 7mil(8" wafer). Die size can be as small as
200*200um. If your grinding/dicing sub-con. could not meet this
spec., please contact Universen.
Lungtan Plane TSK A-WD-5000A
Jessy Lu /
8-inch Fully Automatic Back Grinding Machine 1 set
TSK WD-5000A 8-inch
Fully Automatic Wafer Dicing Machine 4 set
Disco DAD 300 series Automatic Wafer Dicing Machine 7 sets
Disco DAD 600 series Automatic Wafer Dicing Machine 2 sets
Disco DAD 2H/6T series Automatic Wafer Dicing Machine 4 sets
Grinding / Dicing
Related Tools Pre-Owned
Repair Servie Cassette / Frame
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