Circuit Probing / Back Grinding / Wafer Dicing
From the very beginning, Universen has been
dedicated to the wafer dicing service. In order to meet customers'
increasing demand, back grinding & circuit probing services had been added to
our Turn-Key solution.
Our business scope mainly deal with
the following items.
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Silicon Wafer Back Grinding
4 - 8inch capable
150um/6mil (for 6-inch wafer), 175um/7mil (for 8-inch
ROM, Flash ROM, Speech IC, Melody IC, RF ID....
1N4001-7, 1N4148, 1N5817-9, GPP, TVS...
Chip size can be as small as 200*200um / thickness: 150um /
Cutting Street: 40um
Glass & Ceramic Substrate Cutting
Better Quality than Laser cutting
SMT / PCB package / device
- PCB, SMT(Chip
LED), MEMS Any New Substrate suitable
for dicing saw
Solar Cell Cutting
Solar Cell: Round cell / Square
cell / Single-Crystal / Poly-Crystal
Grinding / Dicing
Related Tools Pre-Owned
Equip Repair Service Cassette / Frame
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